Review of suspected defects using one or more reference dies
US9673022B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2015 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Jul 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system for reviewing a wafer, the system may include a memory unit that is configured to store information about locations of a set of suspected defects that are located at multiple dice of the wafer; electron optics that is configured to obtain images of reference elements, wherein the reference elements are located within a first reference die of the wafer; and a processor that is configured to: compare the first sub-set of suspected defects to a first sub-set of reference elements to provide a first evaluation result; and select, in response to the first evaluation result, a source of a second sub-set of reference elements. The electron optics is further configured to obtain images of a second sub-set of reference elements that are located within a second reference die of the wafer when it is determined that the second reference die is the source of the second sub-set of reference elements. The processor is further configured to compare the second sub-set of suspected defects to the second sub-set of reference elements to provide a second evaluation result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.