Electronic device having a lead with selectively modified electrical properties
US9673137B2 · kind B2 · utility
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2References
15Claims
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Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.