Patent · US Active

Wafer edge trim blade with slots

US9676114B2 · kind B2 · utility

4Cited by
17References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 29, 2012
Grant dateJun 13, 2017
Priority date
Expiry dateApr 23, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/9372
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.