Patent · US Active

Dual molded stack TSV package

US9679801B2 · kind B2 · utility

15Cited by

2References

17Claims

0Family size

Assignee

Apple Inc. · US

Inventors

Kwan-Yu Lai · Campbell, US
Jun Zhai · Cupertino, US
Kunzhong Hu · Cupertino, US
Flynn Carson · Redwood City, US

Key dates

Filing date	Jun 3, 2015
Grant date	Jun 13, 2017
Priority date	—
Expiry date	Jun 3, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19106
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Packages including an embedded die with through silicon vias (TSVs) are described. In an embodiment, a first level die including TSVs is embedded between a first redistribution layer (RDL) and a second RDL, and a second level die is mounted on a top side of the first redistribution layer. In an embodiment, the first level die is an active die, less than 50 μm thick.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.