Multi zone heating and cooling ESC for plasma process chamber
US9681497B2 · kind B2 · utility
7Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2014 |
| Grant date | Jun 13, 2017 |
| Priority date | — |
| Expiry date | Mar 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of fluid conduits disposed beneath the top surface. A chuck assembly further includes a plurality of resistive heater rods spatially distribute across the chuck assembly. In embodiments, 169 heater rods and three heat transfer fluid flow controls are independently controlled during execution of a plasma etch process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.