Patent · US Active

Module with integrated power electronic circuitry and logic circuitry

US9681558B2 · kind B2 · utility

20Cited by

6References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Liu Chen · Munich, DE
Markus Dinkel · Unterhaching, DE
Toni Salminen · Munich, DE

Key dates

Filing date	Aug 12, 2014
Grant date	Jun 13, 2017
Priority date	—
Expiry date	Jan 10, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10166
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A integrated power module with integrated power electronic circuitry and logic circuitry includes an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. A method of manufacturing the integrated power module is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.