Sputtering target, sputtering target-backing plate assembly and deposition system
US9685307B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2005 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | May 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a tabular sputtering target on which an erosion portion and a non-erosion portion are formed, and the surface area thereof exceeds 100% but is less than 125% of the surface area when the target is assumed to be planar. Also provided is a tabular sputtering target on which an erosion portion and a non-erosion portion are formed comprising one or more concave portions on the target surface region, and the surface area thereof exceeds 100% but is less than 125% of the surface area when the target is assumed to be planar. An inexpensive, small-capacity power supply unit can be used by minimizing the electrical variations in the sputtering circuit as much as possible throughout the lifespan of the target through self sputtering or high power sputtering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.