Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
US9685358B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
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Key dates
| Filing date | Jan 5, 2016 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Jan 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67023
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a disc-shaped article comprises a spin chuck and at least three individually controllable infrared heating elements. The infrared heating elements are mounted in a stationary manner with respect to rotation of said spin chuck. At least the transparent plate positioned between the infrared heating elements and the underside of a wafer is mounted for rotation with the spin chuck. Alternatively, the transparent plate is part of a housing that encloses the infrared heating elements and that rotates with the spin chuck as the heating elements are stationary relative thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.