Structures for heat dissipating interposers

US9685401B2 · kind B2 · utility

Assignee

• Invensas LLC · US

Inventors

• Cyprian Emeka Uzoh · San Jose, US
• Pezhman Monadgemi · Fremont, US
• Terrence Caskey · Santa Cruz, US
• Fatima Lina Ayatollahi · Fremont, US
• Belgacem Haba · Cupertino, US
• Charles G. Woychik · San Jose, US
• Michael Newman · Fort Collins, US

Key dates

• Filing date: Jul 31, 2015
• Grant date: Jun 20, 2017
• Expiry date: Jul 31, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.