Semiconductor package having an EMI shielding layer
US9685413B1 · kind B1 · utility
6Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2016 |
| Grant date | Jun 20, 2017 |
| Priority date | — |
| Expiry date | Apr 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.