Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods
US9687960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2014 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | May 8, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with slurry contacts a substrate to planarize a surface of the substrate and remove substrate defects while creating debris. A spray system removes the debris from the polishing pad to prevent substrate damage and improve efficiency. By directing fluid under a spray body to the polishing pad and towards an inlet port, the debris may be entrained in the fluid and directed to an inner plenum of the spray body. The fluid-entrained debris is subsequently removed from the inner plenum through an outlet port. In this manner, the debris removal may reduce substrate defects, improve facility cleanliness, and improve pad efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.