Bond pad structure with dual passivation layers
US9691703B2 · kind B2 · utility
1Cited by
12References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 10, 2016 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Jan 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond pad structure with dual passivation layers is disclosed. The bond pad structure includes: a pad material layer on a first passivation layer; a protection layer on the top surface of the pad material layer; a second passivation layer covering on the first passivation layer and the protection layer; and an opening formed through the second passivation layer and the protection layer to expose the pad material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.