Silicon buried digit line access device and method of forming the same
US9691773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2013 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Nov 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An access device includes a plurality of first digit lines (DL) trenches extending along a first direction, buried digit lines between each DL trench, second and third trenches separating the digit lines, a filling material filling the digit line trenches comprising airgaps in each second trench, a plurality of word line (WL) trenches extending along a second direction, metal word lines deposited on the walls of the word line trenches, a filling material filling the word line trenches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.