Combined SADP fins for semiconductor devices and methods of making the same
US9691775B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2016 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Apr 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor cell includes a substrate and an array of at least five substantially parallel fins having substantially equal fin widths disposed on the substrate. The array includes a predetermined minimum spacing distance between at least one pair of adjacent fins within the array. The array has a first n-type fin for an n-type semiconductor device, and a first p-type fin for a p-type semiconductor device. The first p-type fin is disposed adjacent the first n-type fin and spaced a predetermined first n-to-p distance apart from the first n-type fin. The first n-to-p distance is greater than the minimum spacing distance and less than the sum of the fin width plus twice the minimum spacing distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.