Systems and methods for wafer surface feature detection and quantification

US9702829B1 · kind B1 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Haiguang Chen · Millbrae, US
• Jaydeep Sinha · Livermore, US
• Sergey Kamensky · Campbell, US
• Enrique Chavez · Guadalajara, MX
• Shouhong Tang · Tucson, US
• Mark Plemmons · McKinney, US

Key dates

• Filing date: Apr 7, 2014
• Grant date: Jul 11, 2017
• Expiry date: Apr 7, 2034

Classification

• Technology area (CPC G): Physics
• CPC primary: G01B2210/56
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Interferometer systems and methods for providing improved defect detection and quantification are disclosed. The systems and methods in accordance with the present disclosure may detect surface defects on patterned or bare wafer surfaces and subsequently quantify them. In certain embodiments in accordance with the present disclosure, amplitude maps of the wafer surfaces are obtained and are utilized in addition/alternative to phase maps for wafer surface feature detection. Furthermore, local one-dimensional and/or two-dimensional unwrapping techniques are also disclosed and are utilized in certain embodiments in accordance with the present disclosure to provide height and depth information of the detected defects, further improving the detection capabilities of the measurement systems.