Methods of manufacturing semiconductor devices

US9704756B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Uwe Hodel · Munich, DE
• Andreas Martin · Salzburg, AT
• Wolfgang Heinrigs · Dorfen, DE

Key dates

• Filing date: May 11, 2015
• Grant date: Jul 11, 2017
• Expiry date: May 11, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/0135
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes an array having at least one first region and at least one second region. The at least one first region includes at least one first device oriented in a first direction. The at least one second region includes at least one second device oriented in a second direction. The second direction is different than the first direction.