Perforated conductive material for EMI shielding of semiconductor device and components
US9704811B1 · kind B1 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.