Substrate support with feedthrough structure
US9706605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Feb 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for providing electrical currents and substrate supports utilizing the same are provided. In some embodiments, a feedthrough structure may include a body having a wall defining one or more openings disposed through the body from a first end to a second end; one or more first conductors and one or more second conductors each disposed in the wall from the first end to the second end; and a plurality of conductive mesh disposed in the wall, at least one conductive mesh surrounding a first region of the wall including the one or more first conductors and at least one conductive mesh surrounding a second region of the wall including the one or more second conductors, wherein the plurality of conductive mesh substantially electrically insulates the first and second regions from respective first and second external electromagnetic fields respectively disposed outside the first and second regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.