Patent · US Active

Dual-sided die packages

US9711428B2 · kind B2 · utility

4Cited by

2References

19Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Henning Braunisch · Chandler, US
Feras Eid · Chandler, US
Adel A. Elsherbini · Chandler, US
Johanna M. Swan · Scottsdale, US
Don Nelson · Beaverton, US

Key dates

Filing date	Sep 27, 2013
Grant date	Jul 18, 2017
Priority date	—
Expiry date	Sep 27, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10545
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.