Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
US9711479B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
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Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die package having a plurality of connection pads, a plurality of wire leads having metal cores with a defined core diameter, and a dielectric layer surrounding the metal cores having a defined dielectric thickness, at least one first connection pad held in a mold compound covering the die and the plurality of leads connected to at least one metal core, and at least one second connection pad held in the mold compound covering the die and the plurality of leads connected to at least one metal core. Further, the present invention relates to a method for manufacturing a substrate less die package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.