Method of manufacturing baseplate for an electronic module
US9716018B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2016 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Mar 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.