Semiconductor die assemblies with heat sink and associated systems and methods
US9716019B2 · kind B2 · utility
2Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2016 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Apr 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor die assemblies with heat sinks are disclosed herein. In one embodiment, a semiconductor die assembly includes a stack of semiconductor dies and a mold material surrounding at least a portion of the stack of semiconductor dies. A heat sink is disposed on the stack of semiconductor dies and adjacent the mold material. The heat sink includes an exposed surface and a plurality of heat transfer features along the exposed surface that are configured to increase an exposed surface area compared to a planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.