Chemical mechanical polishing slurry
US9718991B2 · kind B2 · utility
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Key dates
| Filing date | May 28, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | May 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.