Electrostatic chuck with photo-patternable soft protrusion contact surface
US9721821B2 · kind B2 · utility
2Cited by
112References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2013 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Jun 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.