Wafer edge shape for thin wafer processing

US9721907B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Helmut Oefner · Zorneding, DE
• Hans-Joachim Schulze · Taufkirchen, DE

Key dates

• Filing date: Nov 18, 2015
• Grant date: Aug 1, 2017
• Expiry date: Nov 18, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/304
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A wafer that includes a front surface, a back surface, and an edge between the front surface and the back surface having a curved edge profile between an edge of the front surface and a side face of the edge of the wafer. The edge profile includes a first convex curve that joins the edge of the front surface, a second convex curve that joins the side face, and an intermediate concave curve that joins the first convex curve and the second convex curve.