Helmut Oefner
26Patents
2h-index
20Co-inventors
53Inventor score
Filing activity: Jun 24, 2014 → Aug 22, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9245811B2 | Method for postdoping a semiconductor wafer | Electricity | 6 | Active |
| US9559020B2 | Method for postdoping a semiconductor wafer | Electricity | 2 | Active |
| US9312120B2 | Method for processing an oxygen containing semiconductor body | Electricity | 1 | Active |
| US9779931B2 | Method of manufacturing semiconductor wafers and method of manufacturing a semiconductor device | Electricity | 1 | Active |
| US11742215B2 | Methods for forming a semiconductor device | Electricity | 1 | Active |
| US10014400B2 | Semiconductor device having a defined oxygen concentration | Electricity | 1 | Active |
| US9972704B2 | Method for forming a semiconductor device and a semiconductor device | Electricity | 1 | Active |
| US9721907B2 | Wafer edge shape for thin wafer processing | Electricity | 1 | Active |
| US10273597B2 | Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device | Electricity | 0 | Active |
| US9728395B2 | Method for manufacturing a semiconductor wafer, and semiconductor device having a low concentration of interstitial oxygen | Electricity | 0 | Active |
| US10957767B2 | Semiconductor device, silicon wafer and method of manufacturing a silicon wafer | Electricity | 0 | Active |
| US10319599B2 | Methods of planarizing SiC surfaces | Electricity | 0 | Active |
| US10026816B2 | Semiconductor wafer and manufacturing method | Electricity | 0 | Active |
| US10724149B2 | Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device | Electricity | 0 | Active |
| US9728627B2 | Method for forming a semiconductor device and a semiconductor device | General | 0 | Revoked |
| US9853137B2 | Method for forming a semiconductor device and a semiconductor device | General | 0 | Revoked |
| US12211703B2 | Methods for forming a semiconductor device having a second semiconductor layer on a first semiconductor layer | Electricity | 0 | Active |
| US10529838B2 | Semiconductor device having a variable carbon concentration | Electricity | 0 | Active |
| US10837120B2 | Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device | Electricity | 0 | Active |
| US10317338B2 | Method and assembly for determining the carbon content in silicon | Physics | 0 | Active |
| US9536838B1 | Single crystal ingot, semiconductor wafer and method of manufacturing semiconductor wafers | Electricity | 0 | Active |
| US9934988B2 | Method for processing a silicon wafer | Electricity | 0 | Active |
| US9972488B2 | Method of reducing defects in an epitaxial layer | Electricity | 0 | Active |
| US9754787B2 | Method for treating a semiconductor wafer | Electricity | 0 | Active |
| US10566198B2 | Doping method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.