Patent · US Active

Directly cooled substrates for semiconductor modules and corresponding manufacturing methods

US9731370B2 · kind B2 · utility

3Cited by

5References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andre Uhlemann · Dortmund, DE
Alexander Herbrandt · Warstein, DE

Key dates

Filing date	Apr 30, 2013
Grant date	Aug 15, 2017
Priority date	—
Expiry date	Dec 17, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module includes a substrate having a metallized first side and a metallized second side opposing the metallized first side. A semiconductor die is attached to the metallized first side of the substrate. A plurality of cooling structures are welded to the metallized second side of the substrate. Each of the cooling structures includes a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. The substrate can be electrically conductive or insulating. Corresponding methods of manufacturing such semiconductor modules and substrates with such welded cooling structures are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.