Lead frame and method for manufacturing the same
US9735096B1 · kind B1 · utility
2Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Jul 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal plate 1 to be a lead frame has a plating with Sn or Zn or a plating with various alloys containing these metals only on the side faces and half-etched faces 6, and a noble metal plating layer formed on the front surface as a surface on which a semiconductor device is to be mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.