Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments
US9739680B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Oct 31, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.