Film forming method, computer storage medium, and film forming system
US9741559B2 · kind B2 · utility
449Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2014 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Feb 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is to form an organic film on a substrate having a pattern formed on a front surface thereof and configured to: apply an organic material onto the substrate; then thermally treat the organic material to form an organic film on the substrate; and then perform ultraviolet irradiation processing on the organic film to remove a surface of the organic film down to a predetermined depth, thereby appropriately and efficiently form the organic film on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.