Using tensile mask to minimize buckling in substrate
US9741581B2 · kind B2 · utility
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2References
13Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 11, 2016 |
| Grant date | Aug 22, 2017 |
| Priority date | — |
| Expiry date | Jan 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for preventing buckling in a substrate using a tensile hard mask is provided. The method may include forming a mask over a substrate, the hard mask including a first area having a pattern for forming a plurality of openings and an adjacent second area free of openings, and the hard mask includes a tensile stress therein. The hard mask may be used to form the plurality of openings in the substrate. Partially eroding the hard mask leaves the substrate with the plurality of openings therein and a substantially planar surface, having diminished buckling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.