Patent · US Active

Encapsulated semiconductor package and method of manufacturing thereof

US9741617B2 · kind B2 · utility

1Cited by
2References
20Claims
0Family size

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Inventors

Key dates

Filing dateNov 16, 2015
Grant dateAug 22, 2017
Priority date—
Expiry dateNov 16, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/18301
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.