Patent · US Active

High density substrate interconnect formed through inkjet printing

US9741664B2 · kind B2 · utility

27Cited by
54References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 5, 2016
Grant dateAug 22, 2017
Priority date—
Expiry dateMay 5, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/013
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Generally discussed herein are systems and apparatuses that include a dense interconnect bridge and techniques for making the same. According to an example a technique can include creating a multidie substrate, printing an interconnect bridge on the multidie substrate, electrically coupling a first die to a second die by coupling the first and second dies through the interconnect bridge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.