Apparatus for printing a chemical mechanical polishing pad
US9744724B2 · kind B2 · utility
41Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2016 |
| Grant date | Aug 29, 2017 |
| Priority date | — |
| Expiry date | Aug 15, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/736
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.