Patent · US Active

Circuit probing structures and methods for probing the same

US9754847B2 · kind B2 · utility

3Cited by

18References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Mill-Jer Wang · Hsinchu, TW
Ching-Nen Peng · Hsinchu, TW
Hung-Chih Lin · Baoshan, TW
Hao Chen

Key dates

Filing date	Sep 4, 2015
Grant date	Sep 5, 2017
Priority date	—
Expiry date	Sep 4, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/06596
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package component includes a stack-probe unit, which includes a first-type connector, and a second-type connector connected to the first-type connector. The first-type connector and the second-type connector are exposed through a surface of the package component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.