Organic-inorganic hybrid structure for integrated circuit packages

US9754849B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Plory Huang · New Taipei, TW
• Henry Su · Westfield, US
• Chee-Key Chung · Bukit Mertajam, MY
• Ryan Jason Ong · Austin, US
• Jones Wang · 西埠镇, CN
• Daniel Hsieh · Gaodong, CN

Key dates

• Filing date: Dec 23, 2014
• Grant date: Sep 5, 2017
• Expiry date: Dec 23, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3511
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.