Method of making a circuitized substrate
US9756724B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2011 |
| Grant date | Sep 5, 2017 |
| Priority date | — |
| Expiry date | Jan 17, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.