Ball bonding metal wire bond wires to metal pads
US9761554B2 · kind B2 · utility
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570References
3Claims
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Assignee
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Key dates
| Filing date | Jul 10, 2015 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Aug 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.