Thermally enhanced fully molded fan-out module
US9761571B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 16, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Sep 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor device can include providing a temporary carrier with adhesive. A first semiconductor die and a second semiconductor die can be mounted face up to the temporary carrier such that back surfaces of the first semiconductor die and the second semiconductor die are depressed within the adhesive. An embedded die panel can be formed by encapsulating at least four sides surfaces and an active surface of the first semiconductor die, the second semiconductor die, and side surfaces of the conductive interconnects in a single step. The conductive interconnects of the first semiconductor die and the second semiconductor die can be interconnected without a silicon interposer by forming a fine-pitch build-up interconnect structure over the embedded die panel to form at least one molded core unit. The at least one molded core unit can be mounted to an organic multi-layer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.