Wafer clamping apparatus
US9768051B2 · kind B2 · utility
1Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2016 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Mar 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer clamping apparatus, including a plurality of support pins under a wafer, the plurality of pins to support the wafer; and a side clamp at a lateral side of the wafer, the side clamp to directly contact a lateral side of the wafer to press the wafer, the side clamp to press the wafer in a first direction or a second direction, the first direction and the second direction being different directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.