Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD
US9768060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2014 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Oct 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76873
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment of the present disclosure, a method for electrochemical deposition on a workpiece includes (a) obtaining a workpiece including a feature; (b) depositing a first conductive layer in the feature; (c) moving the workpiece to an integrated electrochemical deposition plating tool configured for hydrogen radical H* surface treatment and electrochemical deposition; (d) treating the first conductive layer using a hydrogen radical H* surface treatment in a treatment chamber of the plating tool to produce a treated first conductive layer; and (e) maintaining the workpiece in the same plating tool and depositing a second conductive layer in the feature on the treated first conductive layer in an electrochemical deposition chamber of the plating tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.