Replacement gate FinFET process using a sit process to define source/drain regions, gate spacers and a gate cavity
US9768272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Sep 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A replacement gate FinFET manufacturing process in which the source/drain regions, gate structure and gate spacer are all defined by utilizing a single sidewall image transfer technique is provided. In the present application, the source/drain region (i.e., area) are defined by a mandrel structure, while the area for the functional gate structure are defined by the distance between spacers that are located on a pair of neighboring mandrel structures. The gate spacer is defined by the spacer present on the mandrel structures. In some embodiments, semiconductor fin erosion due to gate and gate spacer formation can be reduced or even eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.