Hong He
157Patents
9h-index
84Co-inventors
83Inventor score
Filing activity: Jun 6, 1995 → May 13, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9287135B1 | Sidewall image transfer process for fin patterning | Electricity | 44 | Active |
| US5741468A | Exhaust gas cleaner and method for cleaning exhaust gas | Performing Operations; Transporting | 24 | Expired |
| US9276013B1 | Integrated formation of Si and SiGe fins | Electricity | 16 | Active |
| US9515185B2 | Silicon germanium-on-insulator FinFET | Electricity | 13 | Active |
| US9093326B2 | Electrically isolated SiGe fin formation by local oxidation | Electricity | 12 | Active |
| US9379221B1 | Bottom-up metal gate formation on replacement metal gate finFET devices | Electricity | 12 | Active |
| US9087687B2 | Thin heterostructure channel device | Electricity | 11 | Active |
| US9324830B2 | Self-aligned contact process enabled by low temperature | Electricity | 10 | Active |
| US8951850B1 | FinFET formed over dielectric | Electricity | 9 | Active |
| US9368350B1 | Tone inverted directed self-assembly (DSA) fin patterning | Electricity | 9 | Active |
| US9041094B2 | Finfet formed over dielectric | Electricity | 9 | Active |
| US9716038B2 | Critical dimension shrink through selective metal growth on metal hardmask sidewalls | Emerging Cross-Sectional Technologies | 8 | Active |
| US9099401B2 | Sidewall image transfer with a spin-on hardmask | Electricity | 8 | Active |
| US9595473B2 | Critical dimension shrink through selective metal growth on metal hardmask sidewalls | Emerging Cross-Sectional Technologies | 7 | Active |
| US9431425B1 | Directly forming SiGe fins on oxide | Electricity | 7 | Active |
| US9252243B2 | Gate structure integration scheme for fin field effect transistors | Electricity | 7 | Active |
| US9331148B1 | FinFET device with channel strain | Electricity | 6 | Active |
| US9768272B2 | Replacement gate FinFET process using a sit process to define source/drain regions, gate spacers and a gate cavity | Electricity | 6 | Active |
| US9418900B1 | Silicon germanium and silicon fins on oxide from bulk wafer | Electricity | 5 | Active |
| US8759200B2 | Methods and apparatus for selective epitaxy of Si-containing materials and substitutionally doped crystalline Si-containing material | Electricity | 5 | Active |
| US9515089B1 | Bulk fin formation with vertical fin sidewall profile | Electricity | 5 | Active |
| US9054218B2 | Method of manufacturing a FinFET device using a sacrificial epitaxy region for improved fin merge and FinFET device formed by same | Electricity | 4 | Active |
| US9761699B2 | Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures | Electricity | 4 | Active |
| US9222315B2 | Rotary lock block type drilling riser connector | Mechanical Engineering; Lighting; Heating | 4 | Active |
| US9461174B2 | Method for the formation of silicon and silicon-germanium fin structures for FinFET devices | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.