Alexander Reznicek
1,279Patents
29h-index
208Co-inventors
93Inventor score
Filing activity: Oct 29, 2003 → Aug 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9799736B1 | High acceptor level doping in silicon germanium | Electricity | 398 | Active |
| US8895395B1 | Reduced resistance SiGe FinFET devices and method of forming same | Electricity | 312 | Active |
| US8969934B1 | Gate-all-around nanowire MOSFET and method of formation | Electricity | 308 | Active |
| US7772096B2 | Formation of SOI by oxidation of silicon with engineered porosity gradient | Electricity | 196 | Active |
| US9837414B1 | Stacked complementary FETs featuring vertically stacked horizontal nanowires | Electricity | 105 | Active |
| US7968459B2 | Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors | Emerging Cross-Sectional Technologies | 102 | Active |
| US9653289B1 | Fabrication of nano-sheet transistors with different threshold voltages | Electricity | 96 | Active |
| US7125785B2 | Mixed orientation and mixed material semiconductor-on-insulator wafer | Electricity | 85 | Expired |
| US7087965B2 | Strained silicon CMOS on hybrid crystal orientations | Electricity | 84 | Expired |
| US7023055B2 | CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding | Electricity | 79 | Expired |
| US9443982B1 | Vertical transistor with air gap spacers | Electricity | 71 | Active |
| US9659963B2 | Contact formation to 3D monolithic stacked FinFETs | Electricity | 70 | Active |
| US9570551B1 | Replacement III-V or germanium nanowires by unilateral confined epitaxial growth | Electricity | 67 | Active |
| US9716158B1 | Air gap spacer between contact and gate region | Electricity | 67 | Active |
| US9773913B1 | Vertical field effect transistor with wrap around metallic bottom contact to improve contact resistance | Electricity | 62 | Active |
| US9525064B1 | Channel-last replacement metal-gate vertical field effect transistor | Electricity | 53 | Active |
| US8796093B1 | Doping of FinFET structures | Electricity | 52 | Active |
| US9954058B1 | Self-aligned air gap spacer for nanosheet CMOS devices | Electricity | 47 | Active |
| US9287135B1 | Sidewall image transfer process for fin patterning | Electricity | 44 | Active |
| US9741626B1 | Vertical transistor with uniform bottom spacer formed by selective oxidation | Electricity | 42 | Active |
| US9293459B1 | Method and structure for improving finFET with epitaxy source/drain | Electricity | 39 | Active |
| US9190471B2 | Semiconductor structure having a source and a drain with reverse facets | Electricity | 35 | Active |
| US10170638B1 | Nanosheet substrate isolated source/drain epitaxy by dual bottom spacer | Electricity | 35 | Active |
| US9589845B1 | Fin cut enabling single diffusion breaks | Electricity | 34 | Active |
| US8900951B1 | Gate-all-around nanowire MOSFET and method of formation | Electricity | 32 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.