Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas
US9777380B2 · kind B2 · utility
8Cited by
10References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 6, 2016 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Jul 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.