Patent · US Active

Flexible system-in-package solutions for wearable devices

US9778688B2 · kind B2 · utility

5Cited by

4References

24Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Jiamiao Tang · Shanghai, CN
Junfeng Zhao · Singapore, SG
Michael P. Skinner · San Jose, US
Yong She · Shanghai, CN
Jiun Hann Sir · Air Itam, MY
Bok Eng Cheah · Air Itam, MY
Shanggar Periaman · Butterworth, MY
Kooi Chi Ooi · Air Itam, MY
Yen Hsiang Chew · Bukit Mertajam, MY

Key dates

Filing date	Nov 12, 2014
Grant date	Oct 3, 2017
Priority date	—
Expiry date	Nov 22, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/05
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.