Patent · US Active

Method of forming a bondpad and bondpad

US9780053B2 · kind B2 · utility

0Cited by

5References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Magdalena Hoier · Regensburg, DE
Peter Scherl · Regensburg, DE
Manfred Schneegans · Vaterstetten, DE

Key dates

Filing date	Nov 15, 2015
Grant date	Oct 3, 2017
Priority date	—
Expiry date	Nov 15, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/85365
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various embodiments provide a method of forming a bondpad, wherein the method comprises providing a raw bondpad, and forming a recess structure at a contact surface of the raw bondpad, wherein the recess structure comprises sidewalls being inclined with respect to the contact surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.