Patent · US Active

Semiconductor die assembly and methods of forming thermal paths

US9780079B2 · kind B2 · utility

12Cited by

0References

24Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Jian Li · Boise, US
Steven K. Groothuis · Rowlett, US

Key dates

Filing date	Apr 30, 2015
Grant date	Oct 3, 2017
Priority date	—
Expiry date	Apr 30, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16747
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Semiconductor die assemblies and methods of forming the same are described herein. As an example, a semiconductor die assembly may include a thermally conductive casing, a first face of a logic die coupled to the thermally conductive casing to form a thermal path that transfers heat away from the logic die to the thermally conductive casing, a substrate coupled to a second face of the logic die, and a die embedded at least partially in a cavity of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.