Jian Li
143Patents
12h-index
189Co-inventors
89Inventor score
Filing activity: Jan 18, 2002 → Dec 26, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD781889S1 | Display screen with graphical user interface for a visual scheduling system and method of vehicle movement through yards | General | 75 | Active |
| US6911891B2 | Bistable actuation techniques, mechanisms, and applications | Electricity | 66 | Expired |
| USD822047S1 | Display screen with graphical user interface for visual scheduling system and method of vehicle movement through yards | General | 52 | Active |
| USD895654S1 | Display screen with graphical user interface for visual scheduling system and method of vehicle movement through yards | General | 43 | Active |
| US10978427B2 | Stacked semiconductor die assemblies with partitioned logic and associated systems and methods | Electricity | 31 | Active |
| US8805605B2 | Scheduling system and method for a transportation network | Performing Operations; Transporting | 18 | Active |
| US7305885B2 | Method and apparatus for phased array based ultrasonic evaluation of rail | Physics | 18 | Expired |
| US8972966B2 | Updating firmware in a hybrid computing environment | Physics | 17 | Active |
| US8735216B2 | Memory cell constructions, and methods for fabricating memory cell constructions | Electricity | 14 | Active |
| US9153520B2 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Electricity | 14 | Active |
| US8431961B2 | Memory devices with a connecting region having a band gap lower than a band gap of a body region | Electricity | 13 | Active |
| US9780079B2 | Semiconductor die assembly and methods of forming thermal paths | Electricity | 12 | Active |
| US9287240B2 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Electricity | 12 | Active |
| US9008933B2 | Off-board scheduling system and method for adjusting a movement plan of a transportation network | Performing Operations; Transporting | 12 | Active |
| US9269646B2 | Semiconductor die assemblies with enhanced thermal management and semiconductor devices including same | Electricity | 9 | Active |
| US9323739B2 | Identifying words for a context | Physics | 8 | Active |
| US9691746B2 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Electricity | 8 | Active |
| US7921575B2 | Method and system for integrating ultrasound inspection (UT) with a coordinate measuring machine (CMM) | Emerging Cross-Sectional Technologies | 8 | Active |
| US9627976B2 | Control architecture with improved transient response | Electricity | 7 | Active |
| US7426867B2 | Electromagnetic acoustic transducers for use in ultrasound inspection systems | Physics | 7 | Active |
| US9998000B2 | Balancing charge pump circuits | Electricity | 7 | Active |
| US8766320B2 | Memory devices with a connecting region having a band gap lower than a band gap of a body region | Electricity | 7 | Active |
| US9543274B2 | Semiconductor device packages with improved thermal management and related methods | Electricity | 7 | Active |
| US9197760B2 | Hand activated mode setting | Electricity | 6 | Active |
| US7516663B2 | Systems and method for locating failure events in samples under load | Physics | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.