Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity
US9780080B2 · kind B2 · utility
0Cited by
2References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2014 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Nov 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an optical proximity sensor includes forming a package top plate having an optical transmit opening and an optical receive opening extending therethrough, attaching an optical transmit element to the package top plate adjacent the optical transmit opening, and attaching an optical receive element to the package top plate adjacent the optical receive opening. A package body is formed onto the package top plate to define an optical transmit cavity receiving the optical transmit element and an optical receive cavity receiving the optical receive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.